Abstract
Unrecoverable internal failures of modules in the CDF Run2 Silicon detector have been observed since its installation in early 2001. A fraction of these failures has been categorized as infant mortality. Other failures occurring later were strongly correlated with fixed trigger conditions. These failures are explained by wire-bonds breaking due to fatigue stress induced by resonant vibration. These resonant vibrations are a direct consequence of the oscillating Lorentz forces induced by the 1.4 T magnetic field on wire-bonds carrying non-DC current. Changes have been implemented in data-taking procedures in order to minimize the occurrences of such failures and to prolong the lifetime of the detector itself. A more general analysis of the topic has been pursued. Changes in the packaging and assembly processes for future applications have been investigated.
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