WiP: Floating XY-YX: An Efficient Thermal Management Routing Algorithm for 3D NoCs

Abstract

3D Network-on-Chips (3D NoCs) have higher scalability, higher throughput, and lower power consumption over 2D NoCs. However, the reliability of data transfer in 3D NoCs is seriously threatened by thermal problems. This is due to poor heat dissipation, inappropriate traffic distribution, and cooling restriction for layers away of the chip heat-sink in 3D NoCs. To solve this problem, this paper proposes an efficient deadlock-free and traffic-and thermal-aware routing algorithm, called Floating XY-YX. The main idea behind Floating XY-YX routing algorithm is twofold: 1) to use XY and YX routing algorithms in consecutive layers in dessicate form, and 2) to evenly load the traffic, which is realized by switching the type of XY and YX routing algorithms to YX and XY routing algorithms, respectively. Based on the experimental results, the proposed routing algorithm reduces the temperature variance by 30.74% and traffic variance by 23.77% with respect to the state-of-the-art routing mechanisms.