Whole field displacement measurement technique using speckle interferometry

Abstract

This paper discusses the application of electronic speckle pattern interferometry to electronic packaging materials and assemblies. In-situ measurements were performed on organic based substrates under mechanical loading as well as cavity down ball grid array and flip chip package assemblies under thermal loading. Whole field displacement measurements obtained from this analysis were compared with results obtained from similar finite element models. The experimental flexibility and results obtained from speckle interferometry indicate that this method has several substantial benefits over moire interferometry.