Abstract
The effectiveness of the widely-used whisker mitigation measures for Sn-plated Cu base material (annealing at 150 °C for 1 h or a Ni interlayer) were investigated after temperature cycling and after storage at room temperature. It was found that these measures prevent whisker growth during isothermal storage, but not during temperature cycling. These mitigation measures do apparently not reduce the compressive stress that builds up during temperature cycling due to different coefficients of thermal expansion of Sn and Cu. A change of the Sn microstructure to globular grains is proposed and investigated as potential whisker mitigation measure for temperature cycling.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
