Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

Abstract

We have simultaneously measured the evolution of intermetallic volume, stress, and whisker density in Sn and Pb–Sn alloy layers on Cu to study the fundamental mechanisms controlling whisker formation. For pure Sn, the stress becomes increasingly compressive and then saturates, corresponding to a plastically deformed region spreading away from the growing intermetallic particles. Whisker nucleation begins after the stress saturates. Pb–Sn layers have similar intermetallic growth kinetics but the resulting stress and whisker density are much less. Measurements after sputtering demonstrate the important role of the surface oxide in inhibiting stress relaxation.