Abstract

Numerous approaches have been used to prevent bacterial infection from injured skin, such as bandages and topical creams. However, the higher level of reactive oxygen species, bacterial infections, and excess wound exudates remain the major challenges for wound healing. In this study, we have tailored the structure of wheat gluten hydrolysates (WGH) as a continuous matrix by compositing it with a minimal amount of PVA, PVP, and PEG as polymer crosslinkers (0.5 wt%) to provide film structure integrity. Silver nanoparticles (AgNPs) were impregnated into the WGH to develop a control release matrix of the AgNPs. Scanning electron microscopy, X-ray diffractogram, and functional group patterns of WG and AgNPs indicate a successful integration of AgNPs into the wheat gluten matrix. The swelling capacity of the films was tested at acidic, neutral, and basic pH and was found to be highest in WG/PEG/Ag at pH 9 with 389%. The gradual release of Ag+/AgNPs from the films significantly scavenged free radicals and increased the antibacterial activity with up to a 12 mm inhibition zone against Pseudomonas aeruginosa. According to these findings, WGH with AgNPs has been successfully cast in films with increased absorption capacity, free radicals scavenging, oxidant quenching, and antibacterial capabilities, along with the sustained release of silver ions. The results, therefore, show the potential of the developed films in biomedical applications such as wound dressing.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.