Abstract
AgCu filler metal spreading over TB8 substrate under a high-purity argon atmosphere was conducted at 920 °C. Effects of surface roughness and topography of the substrate on the wetting kinetics were investigated. The interfacial microstructures of AgCu eutectic alloy/TB8 substrate solidified couples was analyzed by optical microscope, scanning electron microscope, energy dispersive spectrometer and transmission electron microscope. Results revealed that the substrate surface roughness and topography had significant influences on the wetting kinetics and spreading process. The spreading was preferential when AgCu molten metal over an anisotropically microstructured surface. When the surface of the substrate was not anisotropic, the spreading morphology was almost a perfect circle. An additional capillary driving force exists when the molten metal flows on the rough surface, which leads to a better wettability. The interfacial microstructure of the resolidified AgCu on the TB8 substrate was Ag(ss)/ Ti3Cu4/Ti2Cu/ /Ti(ss) + Ti2Cu/TB8, and the spreading edge domain near the triple-line is rich in Ag.
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