Abstract
The interactions of Ti and Cr in a Sn0.3Ag0.7Cu melt with graphite were studied by continuous-heating and isothermal wetting experiments. Active Ti and Cr both had positive influences on the wettability of Sn0.3Ag0.7Cu on graphite. The Sn0.3Ag0.7Cu-Ti melt began to spread on graphite at 650 °C, while the Sn0.3Ag0.7Cu-Cr melt needed a temperature higher than 750 °C. Under the same processes, the spreading of the Sn0.3Ag0.7Cu-Cr melt was faster than that of the Sn0.3Ag0.7Cu-Ti melt. For the Sn0.3Ag0.7Cu-Ti/graphite system, the final contact angle was dependent on the isothermal temperature rather than the content of Ti, and the opposite was observed for the Sn0.3Ag0.7Cu-Cr/graphite system. Microanalyses revealed that nonstoichiometric TiCx and Cr-C compounds (Cr3C2 and Cr7C3) formed at the droplet/graphite interface. A smaller stoichiometry x of TiCx or more Cr7C3 in the Cr-C mixture indicated a better wetting. The thermodynamics of the interfacial reaction was calculated, and it was favorable. The faster spreading of the Sn0.3Ag0.7Cu-Cr melt and the more violent interfacial reaction were due to the higher activity of Cr than Ti in the melt.
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