Abstract
Commercial low temperature Sn-based solders including SnIn eutectic solder show non-wetting on Zr55Cu30Al10Ni5 metallic glass (BMG) directly in vacuum sessile drop experiments. The results mean that wetting completely on Zr-based BMGs by adjusting composition of Sn-based solders would fail usually. By utilizing pitting corrosion sensitivity of chloride of Zr-based BMGs, liquid Sn displays a slow wetting and spreading processes of experimental time window on Zr55Cu30Al10Ni5 BMG surfaces, which are pretreated by molten ZnCl2. Six BMG specimens, which are treated in the same way by melting ZnCl2, show different final contact angles by Sn. The different roughness morphology of the BMG surface, which is caused by molten ZnCl2, determines the different final contact angles of Sn. The driving force is caused by liquid Sn nucleation at the interface on modified BMG surfaces, which determines the final contact angle and the time of the spreading process to equilibrium states.
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