Abstract
Nowadays, wafer bumping using solder paste has come into focus as it provides a low cost method. However, since the industries are moving towards lead-free electronic packaging, a new type of no-clean flux was produced specifically for lead-free solder paste. Therefore, this study is used to evaluate the wettability of two different types of no-clean flux onto copper substrate. Besides, its effect towards multiple reflow was also studied. Reflow soldering was conducted for both types of solder paste that contained different type of no-clean flux for up to double reflow. Two different reflow profile was used. The results showed that the Flux A exhibit better soldering performance after first and second reflow soldering. In addition, type of intermetallic compound (IMC) found after first reflow remain the same even after second reflow which was Cu-Sn based. This is shows that Flux A manage to control the diffusion process which will finally leads to a better solder joint performance. Nevertheless, mechanical testing should be carried out in order to evaluate the solder joint strength.
Highlights
As the electronic industry is shifting towards using lead-free solders, solder paste has become popular choice since it can form reliable solder joint in printed circuit board (PCB) through reflow soldering [1,2,3]
This study aims at investigating the growth behaviour of intermetallic compound (IMC) at the solder joint as well as the mean thickness of IMC formed at the solder/Cu interface
The purpose of the current study was to evaluate wettability of the Sn-3.0Ag-0.5Cu solder paste with different type of no-clean flux, namely Flux A and Flux B
Summary
As the electronic industry is shifting towards using lead-free solders, solder paste has become popular choice since it can form reliable solder joint in printed circuit board (PCB) through reflow soldering [1,2,3]. To give a reliable solder joint, the flux itself must have an excellent chemical activity to remove the oxide on the surface of the substrate as well as on the surface of the solder particles. With that, it manage to promote good spreading and giving reliable bonding with the substrate [2]. It manage to promote good spreading and giving reliable bonding with the substrate [2] Other than that, it must be activated thermally but at the same time must not decomposed. It should be able to form benign residues that can be removed by washing [1, 4, 5]
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