Wettability Studies of Pb-Free Soldering Materials

Abstract

For Pb-free soldering materials, two main substitutes are currently being considered, consisting of Sn–Ag and Sn–Ag–Cu eutectics, both with melting points higher than that of the Sn–Pb eutectic. Therefore, both will require higher soldering temperatures for industrial applications. Also, both eutectics have a higher surface tension than the Sn–Pb eutectic, requiring wettability studies on adding Bi, Sb, and In to the eutectics to decrease the melting points and surface tension. The experimental results for the surface tension were compared with thermodynamic modeling by Butler’s method and were used to create the SURDAT database, which also includes densities for pure metals, binary, ternary, quaternary, and quinary alloys. To model the surface tension, excess Gibbs energies of the molten components were taken from the ADAMIS database. For the case of the Ag–Sn system, enthalpies of formation of Ag3Sn from solution calorimetry were used for checking optimized thermodynamic parameters. In the study of Sn–Ag–Cu–Bi–Sb liquid alloys, the range of possible Bi compositions for practical applications has been used to formulate a generalized metric of wettability, which was checked by measurements of the influence of In on the Sn–Ag–Cu system.