Wet Etching Method for Electroless Ni-P Plating of Bi-Te Thermoelectric Element.

Abstract

In this study, a method for electroless Ni-P plating with excellent adhesion via chemical wet etching to fabricate Bi-Te thermoelectric modules is proposed. The electroless Ni-P plating formed through the proposed method showed excellent adherence without peeling, even under heat treatment of 200 °C for 24 h. Wet etching and electroless Ni-P plating was performed on a Bi-Te thermoelectric module, which showed the excellent bond strength of approximately 10 MPa. The surface roughness of the Bi-Te thermoelectric element was increased significantly by the wet etching process, which secured the adherence of the Ni-P plating by anchoring to this induced surface roughness.