Wedge Bonding Wire and Ribbon to Support RF and Optoelectronic Packaging

Abstract

Abstract The proliferation of mobile devices, video on-demand mobile and home, and Internet of Things (IoT), continues to drive an exponential growth in data bandwidth. Meeting the data demand requires continuous improvements in bandwidth and capacity for RF base station modules and optoelectronic modules. RF and Optoelectronic modules have many similar wire bond packaging requirements, especially as optoelectronic data rates continue to increase from 10G through 400G. This paper will provide a survey of RF and Optoelectronic Packages and their common wire and ribbon bond requirements. The paper will also survey the packaging challenges and solutions available to process engineers. Challenges include bonding on a variety of materials, signal pins, RF loop spans and shapes for wire and ribbon, program strategies to maintain constant loop span, referencing challenges, and simplified machine user interactions. The paper will also discuss collaborations between manufacturer and equipment supplier with helpful tips leveraging each other's strengths to transition from concept to production.