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Abstract
The tensile performance of Cu/Sn–58Bi/Cu and Cu/Sn–57.6Bi–0.4Ag/Cu joints were estimated under electric current stressing. The results showed that the joint was strengthened by the addition of Ag due to the refined microstructure. While, the inhomogeneous distribution of current density was more serious in the Cu/Sn–57.6Bi–0.4Ag/Cu joint, which led to elevating temperature gradient and mismatch strain at the Sn/Bi phase interface, and finally weakened the strengthening effect under current stressing.
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