Abstract
In the semiconductor manufacturing industry, W CMP has been widely used in both in FEOL and BEOL. However, in the advanced technology (≤65nm), WCMP is used primarily in FEOL. For FEOL WCMP process, dishing erosion performance is very critical. If the dishing erosion performance is not good, the downstream Cu CMP process will be impacted resulting in copper residue and potential yield loss
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