Abstract
Midinfrared (MIR), which covers numerous molecular vibrational fingerprints, has attracted enormous research interest due to its promising potential for label-free and damage-free sensing. Despite intense development efforts, the realization of waveguide-integrated on-chip sensing system has seen very limited success to date. The huge lattice mismatch between silicon and the commonly used detection materials such as HgCdTe, III-V, or II-VI compounds has been the key bottleneck that hinders their integration. Here, we realize an integration of silicon-on-insulator (SOI) waveguides with black phosphorus (BP) photodetectors. When operating near BP's cutoff wavelength where absorption is weak, the light-BP interaction is enhanced by exploiting the optical confinement in the Si waveguide and grating structure to overcome the limitation of absorption length constrained by the BP thickness. Devices with different BP crystal orientation and thickness are compared in terms of their responsivity and noise equivalent power (NEP). Spectral photoresponse from 3.68 to 4.03 μm was investigated. Additionally, power-dependent responsivity and gate-tunable photocurrent were also studied. At a bias of 1 V, the BP photodetector achieved a responsivity of 23 A/W at 3.68 μm and 2 A/W at 4 μm and a NEP less than 1 nW/Hz1/2 at room temperature. The integration of passive Si photonics and active BP photodetector is envisaged to offer a potential pathway toward the realization of integrated on-chip systems for MIR sensing applications.
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