Abstract

157-nm lithography is being investigated for the sub-65nm technology node of semiconductor devices. Many efforts have been reported on the exposure tool, the F2 laser, the resist materials, the resist processing and the mask materials. A critical component for the success of this 157-nm lithography is the availability of high numerical aperture (NA) lenses that lead to higher resolution capability and a larger process margin. It was reported in a previous article that a 0.85 high NA 157-nm microstepper has demonstrated a resolution capability of 55 nm dense line and space features in combination with an alternating phase shirting mask and using a 120nm thick fluoropolymer resist. The influence of the intrinsic birefringence of the CaF2 lens material on the wavefront aberrations of the projection optic was also experimentally confirmed. In this paper, the effect of the wavefront errors on the imaging performance will be discussed from an evaluation of the short-range flare and the local area flare present in the high numerical aperture (NA) lens.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.