Abstract
In this paper, the thermal-mechanical coupling finite element analysis of MLCC wave soldering with heat conduction and heat convection is calculated, and the steady-state temperature field and transient temperature field as well as the stress distribution of MLCC are obtained. Using the finite element analysis method of indirect thermal-mechanical coupling, the stress analysis is carried out with the temperature field as the boundary condition, and the thermal-structural coupling model is established. By analyzing the thermal stress of MLCC, the weak parts sensitive to thermal stress are determined, which provides a useful reference for solving the reliability problem of MLCC wave soldering.
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