Abstract
AbstractThere has been considerable research into high temperature polymers in recent years and many novel systems have been synthesised. The requirements of high temperature resistance, resistance to moisture, and mechanical strength vie with each other in the selection of materials. In the defence field there are many applications for high temperature polymers, one of which is as high temperature adhesives. A particular problem with adhesives for defence use is that they need to withstand wide operating extremes both of temperature and humidity. A particular class of material that is suitable for high temperature adhesive application is the bismaleimides. The thermal resistance and strength of these materials has been established in previous studies. However, the effect of moisture upon these compositions has not been addressed. This paper covers aspects of diffusion of water into bismaleimide resin systems and is part of an ongoing research programme into high temperature polymers.
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