Warpage Simulation and Analysis for Panel Level Fan-out Package

Abstract

The fan-out package is considered as the mature and advanced technology because of low cost, great thermal management, high electrical performance and reliability. However, the warpage is still an issue when the fan-out panel level packaging is becoming larger and thinner. In this research, the size 510 mm x 410 mm of the fan-out panel level packaging is investigated to analyze the warpage performance during the compression molding process, carrier de-bonding process, redistribution layer (RDL) process, and grinding process. The finite element modeling is conducted to calculate the warpage behavior with a continues step of fan-out manufacture process. The fan-out panel level packaging with support core carrier and without support core carrier are discussed in this paper. The structure with support core carrier is designed to control the warpage during the manufacture process. It is found that elastic modulus and coefficient of thermal expansion (CTE) of EMC are the important factors to reduce the warpage. In the EMC formation, the increasing filler content of EMC can enhance the elastic modulus, the thermal conductivity, and decreasing CTE. Therefore, we can select the appropriate EMC materials or design the formation of EMC to decrease the thermal mismatch between EMC/Si and EMC/RDL. The results also revealed that the carrier material could affect the warpage due to the residual stress. To decrease the residual stress for achieving the flat warpage, the different types of carriers are also studied. Eventually, the structure with support core carrier, EMC materials, and carrier materials are presented to obtain the optimal warpage performance in the fan-out panel level packaging.