Warpage optimization on a mobile phone case using response surface methodology (RSM)

Abstract

Plastic injection moulding is a popular manufacturing method not only it is reliable, but also efficient and cost saving. It able to produce plastic part with detailed features and complex geometry. However, defects in injection moulding process degrades the quality and aesthetic of the injection moulded product. The most common defect occur in the process is warpage. Inappropriate process parameter setting of injection moulding machine is one of the reason that leads to the occurrence of warpage. The aims of this study were to improve the quality of injection moulded part by investigating the optimal parameters in minimizing warpage using Response Surface Methodology (RSM). Subsequent to this, the most significant parameter was identified and recommended parameters setting was compared with the optimized parameter setting using RSM. In this research, the mobile phone case was selected as case study. The mould temperature, melt temperature, packing pressure, packing time and cooling time were selected as variables whereas warpage in y-direction was selected as responses in this research. The simulation was carried out by using Autodesk Moldflow Insight 2012. In addition, the RSM was performed by using Design Expert 7.0. The warpage in y direction recommended by RSM were reduced by 70 %. RSM performed well in solving warpage issue.