Abstract
The effect of warpage on lithographic capabilities of organic circuit boards with multilayered thin film buildup was investigated. Two to six epoxy layers were built on various candidate boards to characterize the warpage and correlate it with analytical models. Underlying mechanisms were investigated and novel parameters defined to correlate warpage with photodefinition of ultrafine lines and vias on the board. Based on the experiments, warpage specifications for the multifunctional multilayered requirements in a proposed system-on-package (SOP) structure were defined. Experimentally validated FEM models were used to estimate the warpage during the multilayered buildup. Results show that FR-4 is not suitable for future high-density packaging needs and underscore the need for stiffer ceramic-based circuit board materials as replacement for FR-4
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