Wafer-level integration technology of surface mount devices using automatic parts alignment technology with vibration

Abstract

This paper presents a new wafer-level integration technology of discrete surface mount devices (SMDs) on silicon-wafers. It is automatic parts alignment on silicon-wafer by means of gravity force and vibration. After silicon IC process, deep holes were formed by deep reactive ion etching (DRIE) process to arrange SMDs. Then a non-conductivity adhesive was spin coated and removed it on the silicon-wafer surface leaving the adhesive at the bottom of the holes. We fixed the silicon-wafer diagonally to a vibration generator and distribute SMDs on it. By vibrating the silicon-wafer, SMDs go down to the lower side occupying the holes automatically. As a result, two different sizes of SMDs were successfully mounted into every hole on silicon wafer. This technology is promising to integrate various discrete devices on integrated devices with batch process-like productivity.