Abstract

In this study, we investigated various approaches to manipulate the flake density, size, and thickness of two-dimensional transition metal dichalcogenides by independently tuning the precursors and process conditions of the metal–organic chemical vapor deposition system. Normally off device characteristics were realized for both the as-grown and transferred cases. Furthermore, we demonstrated the versatility of our growth method by applying it to several commonly used gate dielectric materials, such as SiO2, SiNx, and AlOx.

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