Wafer level characterization and failure analysis of microsensors and actuators

Abstract

In this paper we present three optical inspection techniques that were adapted and upgraded into new automatic wafer-level optical investigation set-ups for in-line parametric and functional yield inspection as well as reliability testing of microsensors and actuators. The techniques are based on optical interferometry, differential interference contrast and laser Doppler vibrometry. They can be applied to a very wide range of microsensors and actuators for which a controlled metrology or a controlled motion is relevant.