Abstract
Military electronic parts are becoming unavailable. Weapon system designers are forced to use commercial plastic encapsulated microcircuits (PEMs). PEMs are susceptible to moisture related failure mechanisms occurring from long-term exposure to moisture even at very low humidity levels. Weapon systems must operate reliably after long-term dormant storage sometimes greater than 30 years. An Army Aviation and Missile Command Manufacturing Technology program is reviewed that provides a process for a potential near-hermetic wafer level seal for long term moisture exposure protection of PEMs. The process also provides potential benefits to the commercial semiconductor manufacturing community.
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