Wafer Container Monitoring Concerning Airborne Molecular Contaminations along a 300 mm Power Semiconductor Production Flow

Peter Franze,Stefan Kaskel,Germar Schneider

doi:10.4028/www.scientific.net/ssp.314.41

Peter Franze, Stefan Kaskel + Show 1 more

Open Access

https://doi.org/10.4028/www.scientific.net/ssp.314.41

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Abstract

The focus of the study was to understand the behavior of airborne molecular contaminations (AMC) within the 300 mm wafer containers called front-opening unified pods (FOUPs) in a high-volume fabrication facility for power semiconductors of Infineon Technologies Dresden. A main goal was to implement new concepts and strategies to prevent the different power semiconductors from any yield losses driven by AMC. It could be shown, that there is a strong dependency of the concentration and the type of the determined contaminations on the investigated process steps.

Highlights

Organic and inorganic contaminations on the one hand and particles on the other hand are already known as main reasons for the yield loss of semiconductor devices
The focus of the study was to understand the behavior of airborne molecular contaminations (AMC) within the 300 mm wafer containers called front-opening unified pods (FOUPs) in a high-volume fabrication facility for power semiconductors of Infineon Technologies Dresden
The analysis of the AMC levels along the process flow of the selected 300 mm power technology within this study was performed with the goal to get a first knowledge about the AMC concentrations and to make sure that the FOUP cleaning processes are placed at the optimal process steps within the entire process flow

Summary

Introduction

Organic and inorganic contaminations on the one hand and particles on the other hand are already known as main reasons for the yield loss of semiconductor devices. The focus of the study was to understand the behavior of airborne molecular contaminations (AMC) within the 300 mm wafer containers called front-opening unified pods (FOUPs) in a high-volume fabrication facility for power semiconductors of Infineon Technologies Dresden. Special interest within this study was on the behavior of acid and basic airborne molecular contaminations (AMC) within the process flow of a high-volume power technology within the wafer fabrication area of Infineon Dresden.

Results

Conclusion