Abstract
This paper describes a novel wafer bonding technique using microwave beating of parylene intermediate layers. The bonding is achieved by parylene deposition and thermal lamination using microwave heating. Variable frequency microwave heating provides uniform, selective, and rapid heating for parylene intermediate layers. The advantages of this bonding technique include short bonding time, low bonding temperature, relatively high bonding strength, less void generation, and low thermal stress. In addition, the intermediate layer material, parylene, is chemically stable and biocompatible. This bonding technique can be used for structured wafers as well because parylene provides a conformal coating. Therefore this is a very attractive bonding tool for many MEMS devices. The bonding strength and uniformity were evaluated using diverse tools. Fracture mechanisms and the effects of bonding parameters and an adhesion promoter were investigated as well. The bonding with a structured wafer was also successfully demonstrated.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
