Abstract
The brittleness accompanying the recrystallization in W filament was investigated by measuring several mechanical properties, electrical resistivity and microstructures. In the straight specimen the brittleness was detected clearly by the bending test, while in the coiled one the decrease of the plastic elongation of coil well corresponded with its recrystallization brittleness. From the observation on the relation between the ductility and the microstructure in coiled specimens, it was found that W filaments which showed long grain-boundary structure were not always brittle after recrystallization. Several considerations were given on the mechanism of the formation of a long grain-boundary structure and analogous experiments were tried on the grain-boundary control in Cu plate. And it was clarified that such long boundary-structure can be formed by adequate doping treatment in such a popular metal as Cu.
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