Vulcanization failure mechanism analysis of lead-frame LED package

Abstract

Light-emitting diodes (LED) failure can be attributed to various factors such as vulcanization, which is considered as one of the primary causes. The main consequence of vulcanization is the production of black silver sulfide, a result of silver and sulfur ion interaction within the plating layer. The consequences of this reaction can be quite severe, leading to a reduction in luminous flux, color temperature drift, golden ball and support fracture. In this work, following an analysis of the process structure characteristics of LED support, four vulcanization failure paths have been identified. To determine the main vulcanization path of the LED stent, various tests, such as the vulcanization corrosion test, the red ink test, and the cross-section test, have been conducted. This work provides an innovative and constructive approach for directing failure research in LED package.