Abstract
Abstract Yield on specific designs often falls far short of predicted yield, especially at new technology nodes. Product-specific yield ramp is particularly challenging because the defects are, by definition, specific to the design, and often require some degree of design knowledge to isolate the failure. Despite the wide variety of advanced electrical failure analysis (EFA) techniques available today, they are not routinely applied during yield ramp. EFA techniques typically require a significant amount of test pattern customization, fixturing modification, or design knowledge. Unless the problem is critical, there is usually not time to apply advanced EFA techniques during yield ramp, despite the potential of EFA to provide valuable defect insight. We present a volume-oriented workflow integrating a limited set of electrical failure analysis (EFA) techniques. We believe this workflow will provide significant benefit by improving defect localization and identification beyond what is available using test-based techniques.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
