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Abstract
AbstractA computational simulation of Kirkendall voiding in metallic materials is presented. After a brief explanation of the phenomena and its consequences on the reliability of microelectronic components we introduce a constitutive model for void nucleation and growth which is based on vacancy diffusion and rate–dependent inelastic deformation. This model can be used to predict the temporal development of voids in solder during thermal cycling and/or impact loading. A numerical study illustrates the potential of the model for the failure analysis. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)
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