Abstract
Void-free micro-pattern of nickel was fabricated electrochemically by applying supercritical carbon dioxide emulsion (Sc-CO2-E). Evolution of hydrogen gas bubbles is usually the cause of defect and pinholes for microstructures fabricated electrochemically using aqueous electrolyte. Defect and pinholes formed dramatically limit application of the micro-sized metallic pattern in fine and complex mechanical systems. Micro-pattern of nickel pillars with diameters from ca. 50 to 125μm was fabricated by using film-type SU-8 as the template and brightener-contained Watts bath as the electrolyte. Height of the nickel pillars is limited by thickness of SU-8 film and controlled by current applied and deposition time. Defect was found for micro-pattern of nickel prepared by conventional method; that is without application of Sc-CO2-E. Void-free micro-pattern of nickel was obtained when Sc-CO2-E was applied with experimental pressure and temperature at 15MPa and 323K, respectively. In addition, the SU-8 film could be simply peeled off using tweezers when electroplated with Sc-CO2-E using 15-μm-thick SU-8 film.
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