Abstract
AbstractProduction Engineering R‘‘void-free’ metallization is proposed. It is shown that void formation is suppressed when the TiAl3 intermediate layer is formed at the interface between the Al alloy and reactively sputtered TiN barrier metal films. We have investigated the relationship between void formation and coverage of the intermediate layer. It is found that a coverage of more than 60 % TiAl3 perfectly suppresses void formation. The interfacial reaction is achieved by using ‘soft TiN', which arises from the short migration length of the sputtered particles impinging on the substrate surface when dc power is decreased. The soft TiN film includes many vacancies and crystallographically disordered regions which easily cause rearrangement of the TiN films by movement of Ti atoms during annealing. It is thought that these Ti atoms compensate vacancies in the Al-Si-Cu film and suppress the formation of Al voids.
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