Void Evolution via Coupled Creep, Diffusion and Electromigration in Confined Nano-interconnects

Abstract

AbstractA three dimensional electromigration model is presented to account for void evolution in small scale interconnects. The model provides better understanding of the evolution process by considering concurrent kinetics of creep flow and surface diffusion. The multiple kinetics and energetics are incorporated into a diffusive interface model. Simulations show that a shape stable in surface diffusion can become unstable in a creep dominated process, which leads to a quite different void morphology.