Abstract
The coupled effect of boiling and condensation inside a flat two-phase thermosyphon has a non-negligible influence on the two-phase fluid flow behavior and heat transfer process. Therefore, a flat two-phase thermosyphon with transparent wall was manufactured. Based on this device, a visualization experiment system was developed to study the vapor–liquid two-phase behaviors and thermal performance of the flat two-phase thermosyphon. A cross-shaped wick using copper mesh was embedded into the cavity of two-phase thermosyphon to improve the heat transfer performance. The effects of heat flux density, working medium, and wick structure on the thermal performance are examined and analyzed. The results indicated that a strong liquid disturbance is caused by the bubble motions, leading to the enhancement of both convective boiling and condensation heat transfer. More bubbles are generated as the heat flux increases; therefore, the disturbance of bubble motion on liquid pool and condensation film becomes stronger, resulting in better thermal performance of the flat two-phase thermosyphon. The addition of the wick inside the cavity effectively reduces the temperature oscillation of the evaporator wall. In addition, the wick structure provides backflow paths for the condensate owing to the effect of capillary force and enhances the vapor–liquid phase change heat transfer, resulting in the improvement of thermal performance for the flat two-phase thermosyphon.
Highlights
Efficient cooling technologies have always been the subject of both scientific and engineering investigation in high-powered electronics circuits
When there is a heat load imposed on the flat two-phase thermosyphon, the gravity-driven vapor–liquid two-phase self-circulation flow is generated in the cavity, accompanied by sensible heat transport and latent heat transport
This paper began an of observation of boiling the coupled boiling and phase change inside confined cavity, and cavity, the effects heatthe flux, working medium, wick condensation phase the change inside the confined andofnow effects of heat flux, and working structure on two-phase flow behaviors and thermal performance of thermal the flat two-phase thermosyphon medium, and wick structure on two-phase flow behaviors and performance of the flat are examined and analyzed
Summary
Efficient cooling technologies have always been the subject of both scientific and engineering investigation in high-powered electronics circuits. Aiming to achieve highly efficient heat dissipation of high-heat-flux electronics, several advanced cooling technologies, including boiling cooling [1,2,3], liquid cooling [4,5], functional surface [6,7], microchannels heat sink [8,9,10], heat pipes [11,12,13], microfluidic engineering [14,15], metal foam [16], etc., have been introduced and applied in every field Among these advanced cooling technologies, the heat pipes (such as grooved heat pipes [17], pulsation heat pipes [18], thermosyphons, etc.) are most widely used for the heat dissipation of microelectronic devices under high heat flux density due to high heat transfer capacity, good temperature uniformity, and no power consumption [19]. The heat is mainly transferred by the process of boiling and condensation inside the flat two-phase thermosiphon These two processes coexist in the confined cavity and interact with each other, resulting complex vapor–liquid two-phase flow behaviors. The effects of heat flux density, working medium, and wick structure on the vapor–liquid two-phase flow behavior and thermal performance are examined and investigated
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