Abstract
Various researchers have investigated the mechanism of chemical mechanical polishing (CMP). Although the slurry flow in a microscopic pad asperity is thought to play a critical role in the transport of abrasive particles to the wafer surface, this has not been completely explained. In this study, we devised a visualization method for the slurry flow in the pad asperity area, created an experimental apparatus for visualization, and attempted to obtain the flow velocity vector.
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