Abstract
This paper presents a method to inspect a printed circuit board. We use a feature-based system which matches symbolic descriptions of an object and a model. These symbolic descriptions are derived from line segments detected in an image. A model is built from a perfect board together with the expected defects. The matching technique is a variation of a line matching method (“Kernel” method) successfully applied at USC on aerial images. The results are then interpreted to generate a description of the match.
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