Abstract
Pick up and placement tools (collet) are one of important tools for semi-conduct manufacturing process. It should have acceptable precision and reliability of shape to pick the piece of wafer and chip without damages. To defect detection of pick up tools such as wrong size of hole and flaw in collet surface plays an important role in tool manufacturing process. In this study, we propose a visual inspection system to defect detection based on pattern matching algorithm. Experiments were performed to evaluate the proposed visual inspection system and showed 99.3% of success rate to detect defection.
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