Abstract
We demonstrate flip-chip light-emitting diodes (FC-LEDs) on a flexible yttria-stabilized zirconia (YSZ) substrate and compare them with FC-LEDs on a polymeric substrate. Degradation of luminescence intensity and red-shift of peak wavelength are not observed for the LED on the flexible YSZ, unlike one on the polyimide substrate, due to improved capability to remove the generated heat from the chip to the substrate. Thermal distribution measurements and finite-element simulations show improved thermal management by the flexible ceramic as compared with previously developed flexible LEDs on polymeric substrates. The results present an improved solution to high power operation of flexible LEDs.
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