Abstract
ABSTRACTThis paper describes the viscoelastic characterization of a highly filled epoxy molding compound commonly used in electronic packaging applications. Both stress relaxation tests and constant strain rate tensile tests were conducted. The material was found to be nonlinear in its viscoelastic behavior and to be amenable to horizontal shifting to form master curves. A representation of the master stress relaxation curves in terms of a Prony series is given, and the use of this representation illustrated in the context of both linear and nonlinear representations of the viscoelastic behavior to predict the results of the constant strain rate experiments.
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