Viscoelastic behavior of Cytec FM73 adhesive during cure

Abstract

AbstractIn this work, the viscoelastic properties of Cytec FM73 structural film adhesive were characterized. Several resin plates were cured using various process cycles to achieve a range of final cure states. Specimens cut from these plates were tested using a dynamic mechanical analyzer (DMA) and the glass‐transition temperature at each degree of cure was determined. Stress relaxation tests at different temperatures were then performed using DMA in stress relaxation mode and time‐temperature superposition was used to generate master stress relaxation curves and associated shift functions for each degree of cure. Several different constitutive models were examined for their ability to describe relaxation modulus development during cure. A simple three‐parameter model consisting of a stretched exponential with cure‐dependent terms was found to provide the best results. The results indicate that of the parameters used in the model, relaxation time strongly depends on cure state. The empirical DiBenedetto equation was used to obtain an expression for glass‐transition temperature as a function of degree of cure. This expression was in turn used to derive a new relation to describe stress relaxation time as a function of degree of cure. The shift function was modeled using a simplified form of the Vogel equation with cure‐dependent coefficients. Good correlation between measured relaxation modulus and model predictions was observed. © 2003 Wiley Periodicals, J Appl Polym Sci 91: 2548–2557, 2004