Abstract
Failure of an electronic package generally initiates from the interface corners, due to the stress and strain singular behaviors near the corners. Since the solder materials are viscous elastic and even maybe viscous plastic, the singular behavior near the solder joint corner is thereby time-dependent, and is quite different from that of an elastic one. It is necessary to clarify such a singular behavior for the strength and life evaluation of an electronic package. This paper firstly has deduced the approximated viscous elastic singular fields theoretically based on the principle of correspondence and the Laplace transformation techniques, and secondly has investigated the viscous plastic singular behavior of an elastic-plastic interface corner by the analogue method; finally the numerical analysis of an electronic package has been carried out to show the details of the singular behaviors.
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