Abstract
Vibration characteristics of high frequency and complex vibration systems of 160 kHz to 1 MHz for ultrasonic wire ball bonding are studied. High-frequency and complex vibrations have been shown to be very effective for ultrasonic wire bonding of IC, LSI, or various electronic devices. Required vibration displacement amplitude for successful bonding of a 600-kHz system is about 1/30 that of a conventional 60-kHz system. For installing a conventional ceramic capillary 1.8575 mm in diameter required for ball bonding, longitudinal to complex transverse vibration systems 5.5–7.0 mm in diameter are proposed. Vibration velocity distributions along longitudinal, transverse vibration systems and ceramic capillaries and vibration loci are measured by laser Doppler vibrometers. The ceramic capillaries are measured vibrating in transverse vibration modes with one, two, or three vibration nodes along them at 160 kHz to 1 MHz, and the conventional capillaries are revealed applicable in such high-frequency systems. The free edge of the capillary vibrates in elliptical or circular locus with the two longitudinal vibration systems driven simultaneously. Maximum vibration velocity at a capillary tip is over 0.5 m/s (peak-to-zero value) which is enough for bonding of thin wires successfully at high frequencies.
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