Abstract
Once a device goes into high volume production if the part has not been characterized correctly the customer will start to see problem devices and returns will start to flow. This paper will show a correlation of One Time Programmable fuse failures that occur at low temperature to very low supply voltage test at room temperature. Multiple wafermaps will be presented showing the effects of the low temperature and the effect of screening at very low voltage on both good material and material exhibiting a step field issue causing OTP failures. This will then be further developed to demonstrate how the neighbor dice that would need manual inking are caught with the very low supply voltage test. This work will also go some way to proving previous papers' theories on very low voltage testing to find resistive bridge faults at low temperature failures.
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