Abstract
Efficient thermal management relies on constructing a network structure. Here, we propose an efficient strategy for fabricating an in-plane vertically interconnected network by integrating copper nanoparticles and nanowires through electrospinning and vertically stacking hot-pressing. This approach offers a dual benefit: creating an in-plane vertically interconnected thermal conductive network while simultaneously protecting the fillers against oxidation. Furthermore, the combination of multi-dimensional hybrid fillers reduces interfacial thermal resistance. Thus, the (Cu NPs-Cu NWs)@PVP/PVA film with hybrid fillers achieves a high thermal conductivity of 22.71 Wm-1K-1, along with superior thermal stability, oxidation resistance, and flexibility, making it promising for advanced electronic device thermal management.
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