Abstract
This paper presents two different approaches that may allow the optical interconnection between superposed levels of multilayer photonic circuits as, for example, in optical-networks-on-chip. The first configuration is based on multi-mode interference devices, while the second one exploits multiple stacked directional couplers. The issues concerning the analytical and numerical design of such devices are discussed, together with a performance analysis in terms of efficiency and footprint.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
