Abstract
The mechanisms of dynamic recovery and dynamic recrystallization significantly affect the mechanical behavior and microstructure of the materials deformed at high temperatures. The modified Kocks and Mecking (K–M) model was used to assess the evolution of dislocation density of pure copper under high-temperature compression. The relationship between the deformation conditions and model parameters was derived and verified. The model offers quantitative prediction of flow stress curves, a recrystallized fraction, and recrystallized grain size under different conditions. The model can well integrate the recrystallization mechanism during deformation. The dislocation density and dynamic recrystallization evolution of pure copper provide a basis for optimizing thermomechanical processing in different fields of industry.
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