Abstract
The authors present a new compact optically pumped vertical external-cavity surface-emitting laser (OP-VECSEL), which consists of an optically pumped semiconductor chip surrounded by vertical-cavity surface-emitting laser (VCSEL) chips mounted together on one heat sink. This configuration allows to reach 10 W optical output power in single-mode operation with a very compact design. Furthermore, the authors reveal further improvements, which lead to a compact laser module with high power, highest beam quality and potentially low manufacturing costs.
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