Abstract
The present paper describes the preparation of nichrome thin films at ambient temperature in a vacuum of the order of about 10 -5 torr, on Corning 7059 glass substrates. The variation of the resistance of the nichrome film during deposition is studied for two average deposition rates. Results show that the variation of resistance during deposition is strongly dependent on the deposition rate. Experimental curves are fitted to an empirical relation. Experimental and empirical results show very good agreement in the 10 4-10 2 Ohm/sq. range. Further, a possibility is suggested for relating the parameters in the empirical relation to the deposition rate.
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